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| E2801/E2801LF GR-253-Core SMC (SONET minimum clock) and ITU G.813 Option 2 Minature Surface Mount TCXO ISSUE 2 ; 13 JUNE 2005 Nominal Frequency, Fo s 20.0MHz Supply Voltage s 3.3V 5% Input Current s < 6mA Output s Type : HCMOS s Load : 15pF max s Vol : < 0.1 Vs s Voh : > 0.9 Vs s Duty Cycle @ 50%: 45% to 55% s Rise Time, 10% to 90%: <8ns s Fall Time, 90% to 10%:<8ns Holdover Stability < 4.6ppm Incl. s Temperature, -40 to 85C: s Supply Voltage, 3.3V 5% s Ageing 24 hours: < 0.5ppm, equivalent to <5.8x10-12/sec Free-Run Accuracy < 20.0ppm ref.Fo Incl. s Calibration @ 25C, s Temperature -40 to 85C s Supply Voltage 3.3V 5%, s Load 15pF 10% s Reflow Soldering and Ageing 20 years Phase Noise s 10Hz < -85dBc/Hz s 100Hz <-110dBc/Hz s 1kHz <-125dBc/Hz s >10kHz <-135dBc/Hz Tri-state Pad 8 open circuit or >0.6Vs : Output Enabled s Pad 8 < 0.2Vs : Output in tri-state mode s When in tri-state, the output stage is disabled but the oscillator and compensation circuit are still active, (Current consumption < 1mA) s Marking (laser) s Manufacturers ID (CMAC) s Manufacturers identifier (xx) s Pad 1 / Static Sensitivity Identifier () s Abbreviated Part Number (2801) s Oscillator's Date of Manufacture (YW) Note: Production parts will be marked in this format. Sample marking may vary. CMAC xx 2801 YW s Environmental Specification Storage Temperature Range: -55 to 125C Vibration: IEC 60068-2-6 Test Fc Procedure B4, 10-60Hz 1.5mm displacement, at 98.1 m/s2, 30 minutes in each of three mutually perpendicular axes at 1 octave per minute. Shock: IEC 60068-2-27 Test Ea, 980m/s2 acceleration for 6ms duration, 3 shocks in each direction along three mutually perpendicular axes. Solderability: MIL-STD-202, Method 208, Catergory 3. Resistance to Soldering heat: 260C / 10 seconds exposure RoHS/Soldering: Parts with the suffix `LF' on the part number are fully compliant with the European Union directive 2002/95/EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Note: The RoHS compiant parts are suitable for assembly using both Lead-free solders (see Lead-free Reflow soldering profile) and Tin/Lead solders (see Tin/Lead Reflow soldering profile). ZALINK APPROVED PRODUCTS s s s SEMTECH APPROVED PRODUCTS s Outline in mm Pad Connections 1.Do not connect 2.N/C 3.Do not connect 4.GND 5.Output 6.N/C 7.N/C 8.Tri-state Control* 9.Supply, +Vs 10.Do not connect, or connect to GND *Leave unconnected if not required 7.00.15 0.6 2.54 0.8 1.00.20 2.0 max 98 7 65 1.500.20 0.6 2.54 10 4 1 23 2.0 Lead Free Reflow Soldering Profile * 300 Time above 217C: 60 to 150 secs Time 25C to Peak Temp: 480 sec max Peak Temp +0 260C -5 C 20 to 40 sec 200 150C to 200C m ax 5.00.15 60 to 180 seconds 100 50 Tin / Lead Reflow Soldering Profile * 300 Time above 183C: 60 to 150 secs Time 25C to Peak Temp: 360 sec max Peak Temp +0 240C -5 C 10 to 30 sec 200 100C to 150C m ax *Note: o Co 60 to 120 seconds 100 50 These profiles were used during the qualification testing of the product and therefore represent worst case conditions. They are not recommended for use by the customer in the actual assembly of these parts 3 C/ se c SEMTECH APPROVED PRODUCTS o Co o ld n, w cm se C/ 6 3 C/ se c ax o ld n, w cm se C/ 6 ax |
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